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[VA/VE Case] U-shaped Bending Fit

A case of developing a bonding method that bends a film sensor into a U-shape!

We would like to introduce a VA/VE case study on "U-shaped bending adhesion" that our company conducted. There was a challenge where the film sensor could not fit within the product size. To accommodate the sensor in the limited space of the capacitive touch panel, bending was necessary, but there was a risk of damage due to the bending. We explored and realized a processing method to avoid the risks of damage from bending and the generation of bubbles caused by joining the bent surfaces. 【Case Overview】 ■Challenge: The film sensor could not fit within the product size. ■Effect: The sensor could be installed within the limited space. *For more details, please refer to the related links or feel free to contact us.